DocumentCode
1044522
Title
Pocket implantation effect on drain current flicker noise in analog nMOSFET devices
Author
Wu, Jun-Wei ; Cheng, Chih-Chang ; Chiu, Kai-Lin ; Guo, Jyh-Chyurn ; Lien, Wai-Yi ; Chang, Chih-Sheng ; Huang, Gou-Wei ; Wang, Tahui
Author_Institution
Dept. of Electron. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
Volume
51
Issue
8
fYear
2004
Firstpage
1262
Lastpage
1266
Abstract
The pocket implantation effect on drain current flicker noise in 0.13 μm CMOS process based high performance analog nMOSFETs is investigated. Our result shows that pocket implantation will significantly degrade device low-frequency noise primarily because of nonuniform threshold voltage distribution along the channel. An analytical flicker noise model to account for a pocket doping effect is proposed. In our model, the local threshold voltage and the width of the pocket implant region are extracted from the measured reverse short-channel effect, and the oxide trap density is extracted from a long-channel device. Good agreement between our model and the measurement result is obtained without other fitting parameters.
Keywords
CMOS analogue integrated circuits; MOSFET; doping; flicker noise; ion implantation; semiconductor device models; 0.13 micron; CMOS process; analog nMOSFET devices; drain current flicker noise; fitting parameters; local threshold voltage; long-channel device; nonuniform threshold voltage distribution; oxide trap density; pocket doping effect; pocket implant region width; pocket implantation effect; reverse short-channel effect; 1f noise; Analytical models; CMOS process; Degradation; Doping; Low-frequency noise; MOSFET circuits; Semiconductor device modeling; Semiconductor process modeling; Threshold voltage; Flicker noise; modeling; nonuniform threshold voltage; pocket implant;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2004.831369
Filename
1317147
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