DocumentCode :
1044637
Title :
An Integer-Linear-Programming-Based Routing Algorithm for Flip-Chip Designs
Author :
Fang, Jia-Wei ; Hsu, Chin-Hsiung ; Chang, Yao-Wen
Author_Institution :
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei
Volume :
28
Issue :
1
fYear :
2009
Firstpage :
98
Lastpage :
110
Abstract :
The flip-chip package provides a high chip-density solution to the demand for more input-output pads of very large scale integration designs. In this paper, we present the first routing algorithm in the literature for the preassignment flip-chip routing problem with a predefined netlist among pads and wire-width and signal-skew considerations. Our algorithm is based on integer linear programming (ILP) and guarantees to find an optimal solution for the addressed problem. It adopts a two-stage technique of global routing followed by detailed routing. In global routing, it first uses three reduction techniques to prune redundant solutions and create a global-routing path for each net. Without loss of the solution optimality, our reduction techniques can further prune the ILP variables (constraints) by 85.5% (98.0%) on average over a recent reduction technique. The detailed routing applies passing-point assignment, net-ordering determination, and X-based gridless routing to complete the routing. Experimental results based on five real industry designs show that our router can achieve 100% routability and the optimal global-routing wirelength, and satisfy all signal-skew constraints, under reasonable central-processing-unit times, whereas recent related work has resulted in much inferior solution quality.
Keywords :
VLSI; flip-chip devices; integer programming; linear programming; network routing; X-based gridless routing; flip-chip package; high chip-density solution; integer linear programming; integer-linear-programming-based routing algorithm; net-ordering determination; passing-point assignment; Algorithm design and analysis; Chip scale packaging; Electronics packaging; Energy consumption; Helium; Integer linear programming; Routing; Semiconductor device packaging; Signal design; Very large scale integration; Detailed routing; global routing; layout; physical design;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2008.2009151
Filename :
4723647
Link To Document :
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