Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys

Author

Bonda, N.R. ; Noyan, I.C.

Author_Institution

Semicond. Products Sector, Motorola Inc., Tempe, AZ, USA

Volume

19

Issue

2

fYear

1996

fDate

6/1/1996 12:00:00 AM

Firstpage

208

Lastpage

212

Abstract

The data obtained from bulk test specimens are often used in deformation models to predict the mechanical response of actual parts that are very different in size and shape, such as solder joints in very large scale integration (VLSI) surface mount components. Such predictions are valid only if the size of the solder joints exceeds the “representative deformation volume” of the bulk specimens, In a previous article, we reported the representative volume of a large Pb-Sn eutectic alloy specimen as a function of applied (uniaxial) tensile strain, and showed that the representative volume was much larger than the size of common surface mount technology (SMT) solder joints, In the present study, the measurement of the representative volume is extended to a single-phase solder alloy (98Pb-2Sn, wt%) deformed in both tension and cyclic loading

Keywords

deformation; lead alloys; soldering; surface mount technology; tensile testing; tin alloys; PbSn; cyclic loading; deformation models; mechanical properties; mechanical response; representative deformation volume; single-phase solder alloy; specimen size; surface mount components; tensile strain; Deformable models; Mechanical factors; Predictive models; Shape memory alloys; Soldering; Strain measurement; Surface-mount technology; Tensile strain; Testing; Very large scale integration;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.506106

Filename

506106