• DocumentCode
    1046034
  • Title

    Design optimization of a laser bond tool

  • Author

    Economikos, Laertis ; Sherif, Raed

  • Author_Institution
    IBM Microelectron., Hopewell Junction, NY, USA
  • Volume
    19
  • Issue
    2
  • fYear
    1996
  • fDate
    6/1/1996 12:00:00 AM
  • Firstpage
    234
  • Lastpage
    239
  • Abstract
    This study is concerned with the design of a laser bond tool operating at a laser power of less than 8 W, having a life of more than 25000 bonds and meeting the laser safety requirements of the manufacturing environment. The finite-element method (FEM) was used to predict temperature and stress profiles during the bonding process. Laser tool optimization involves selection of wall and cap thicknesses to provide a fast temperature rise of the tool-wire interface while maintaining stresses at a safe level. For the range of wall and cap thicknesses considered, it was found that there is a critical wall thickness above which the stresses induced in the tool are not conducive to tool cracking. Larger wall thickness, however, was found to adversely affect the transient thermal energy transmitted to the wire: Capping thickness was found to be a minor contributor to the stresses induced in the tool. A tool having a capping thickness of 260 μm and wall thickness of 250 μm was recommended
  • Keywords
    finite element analysis; laser beam applications; lead bonding; tape automated bonding; 250 micron; 260 micron; 8 W; TAB; bonding process; cap thickness; diffusion bonding; finite-element method; laser bond tool; laser safety requirements; manufacturing environment; tool cracking; tool-wire interface; transient thermal energy; wall thickness; Bonding processes; Design optimization; Finite element methods; Manufacturing; Optical design; Power lasers; Safety; Temperature; Thermal stresses; Wire;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.506109
  • Filename
    506109