DocumentCode
1046034
Title
Design optimization of a laser bond tool
Author
Economikos, Laertis ; Sherif, Raed
Author_Institution
IBM Microelectron., Hopewell Junction, NY, USA
Volume
19
Issue
2
fYear
1996
fDate
6/1/1996 12:00:00 AM
Firstpage
234
Lastpage
239
Abstract
This study is concerned with the design of a laser bond tool operating at a laser power of less than 8 W, having a life of more than 25000 bonds and meeting the laser safety requirements of the manufacturing environment. The finite-element method (FEM) was used to predict temperature and stress profiles during the bonding process. Laser tool optimization involves selection of wall and cap thicknesses to provide a fast temperature rise of the tool-wire interface while maintaining stresses at a safe level. For the range of wall and cap thicknesses considered, it was found that there is a critical wall thickness above which the stresses induced in the tool are not conducive to tool cracking. Larger wall thickness, however, was found to adversely affect the transient thermal energy transmitted to the wire: Capping thickness was found to be a minor contributor to the stresses induced in the tool. A tool having a capping thickness of 260 μm and wall thickness of 250 μm was recommended
Keywords
finite element analysis; laser beam applications; lead bonding; tape automated bonding; 250 micron; 260 micron; 8 W; TAB; bonding process; cap thickness; diffusion bonding; finite-element method; laser bond tool; laser safety requirements; manufacturing environment; tool cracking; tool-wire interface; transient thermal energy; wall thickness; Bonding processes; Design optimization; Finite element methods; Manufacturing; Optical design; Power lasers; Safety; Temperature; Thermal stresses; Wire;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.506109
Filename
506109
Link To Document