• DocumentCode
    1046182
  • Title

    Single Event Mechanisms in 90 nm Triple-Well CMOS Devices

  • Author

    Roy, Tania ; Witulski, A.F. ; Schrimpf, R.D. ; Alles, M.L. ; Massengill, L.W.

  • Author_Institution
    Vanderbilt Univ., Nashville, TN
  • Volume
    55
  • Issue
    6
  • fYear
    2008
  • Firstpage
    2948
  • Lastpage
    2956
  • Abstract
    Single event charge collection mechanisms in 90 nm triple-well NMOS devices are explained and compared with those of dual-well devices. The primary factors affecting the single event pulse width in triple-well NMOSFETs are the separation of deposited charge due to the n-well, potential rise in the p-well followed by the injection of electrons into the p-well by the source, and removal of holes by the p-well contact. Design parameters of p-wells, such as contact area, doping depth and placement, are varied to reduce single event pulse widths. Pulse width decreases as the area of the p-well contacts increases, the p-well contacts become deeper, and the p-well contacts are placed more frequently. Increasing the p-well-n-well junction depth also causes the full width half rail (FWHR) pulse width to decrease.
  • Keywords
    MOSFET; nanoelectronics; p-n junctions; semiconductor doping; doping depth; dual-well device; full width half rail pulse width; p-well-n-well junction depth; single event mechanism; size 90 nm; triple-well CMOS device; triple-well NMOS device; triple-well NMOSFET; CMOS technology; Capacitance; Doping; MOS devices; MOSFETs; Pulse shaping methods; Pulse width modulation; Space vector pulse width modulation; Testing; Voltage; Parasitic bipolar; TCAD; p-well contact doping depth; potential modulation; pulse shape; pulse width; single event; triple well;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2008.2005831
  • Filename
    4723805