Title :
Unlocking Smart Phone through Handwaving Biometrics
Author :
Lei Yang ; Yi Guo ; Xuan Ding ; Jinsong Han ; Yunhao Liu ; Cheng Wang ; Changwei Hu
Author_Institution :
Sch. of Software, Tsinghua Univ., Beijing, China
Abstract :
Screen locking/unlocking is important for modern smart phones to avoid the unintentional operations and secure the personal stuff. Once the phone is locked, the user should take a specific action or provide some secret information to unlock the phone. The existing unlocking approaches can be categorized into four groups: motion, password, pattern, and fingerprint. Existing approaches do not support smart phones well due to the deficiency of security, high cost, and poor usability. We collect 200 users´ handwaving actions with their smart phones and discover an appealing observation: the waving pattern of a person is kind of unique, stable and distinguishable. In this paper, we propose OpenSesame, which employs the users´ waving patterns for locking/unlocking. The key feature of our system lies in using four fine-grained and statistic features of handwaving to verify users. Moreover, we utilize support vector machine (SVM) for accurate and fast classification. Our technique is robust compatible across different brands of smart phones, without the need of any specialized hardware. Results from comprehensive experiments show that the mean false positive rate of OpenSesame is around 15 percent, while the false negative rate is lower than 8 percent.
Keywords :
biometrics (access control); message authentication; smart phones; support vector machines; OpenSesame; SVM; false positive rate; fine-grained feature; handwaving action; handwaving biometrics; screen locking; screen unlocking; secret information; smart phone; statistic feature; support vector machine; waving pattern; Accelerometers; Intelligent sensors; Magnetic sensors; Mobile computing; Sensor phenomena and characterization; Smart phones; Smart phone; accelerometer; authentication; privacy; security;
Journal_Title :
Mobile Computing, IEEE Transactions on
DOI :
10.1109/TMC.2014.2341633