• DocumentCode
    1047376
  • Title

    \\hbox {CO}_{\\bf 2} Reforming of Aliphatic Hydrocarbons With Silent Discharge Plasma

  • Author

    Sugasawa, Masami ; Futamura, Shigeru

  • Author_Institution
    Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba
  • Volume
    44
  • Issue
    1
  • fYear
    2008
  • Firstpage
    46
  • Lastpage
    52
  • Abstract
    CO2 reforming of methane ( CH4) and propane (C3H8) was performed with a silent discharge reactor (SDR). The reactor performance was evaluated in terms of energy efficiencies for the conversion of the substrates and formation of H2 and CO. The reactivity of C3H8 was 2- to 3-fold higher than that of CH4, and both of CH4 and C3H8 were reformed in the order of 1016 molecules/J at 298 K. The energy efficiencies for the conversion of these substrates increased with their initial concentrations, but decreased with an increase in reactor energy density. On the other hand, the energy efficiencies for the conversion of CO2, which were not affected by the hydrocarbon types, were lower than those for the hydrocarbon substrates. A positive temperature effect was observed in the conversion of the hydrocarbon substrates only at low reactor energy densities from 298 to 433 K.
  • Keywords
    carbon compounds; chemical reactors; discharges (electric); dissociation; organic compounds; CO2; aliphatic hydrocarbon; carbon monoxide formation; low reactor energy density; methane carbon dioxide reforming; methane reactivity; molecular hydrogen formation; propane carbon dioxide reforming; propane reactivity; reactor performance; silent discharge plasma; substrate conversion; temperature 298 K to 433 K; Air pollution; Chemical industry; Chemical technology; Electrodes; Energy efficiency; Hydrocarbons; Hydrogen; Image converters; Inductors; Plasma temperature; $hbox{CO}_{2}$ ; Aliphatic hydrocarbons; energy efficiency; reforming; silent discharge;
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/TIA.2007.912759
  • Filename
    4439788