DocumentCode
1047463
Title
Static temperature distribution in IC chips with isothermal heat sources
Author
Bilotti, Alberto A.
Author_Institution
Buenos Aires, University, Buenos Aires, Argentina
Volume
21
Issue
3
fYear
1974
fDate
3/1/1974 12:00:00 AM
Firstpage
217
Lastpage
226
Abstract
An analytical solution for the static temperature distribution on the surface of a heat-sinked integrated chip with one isothermal heat source is derived. The mathematical technique applied to solve the Laplace equation is a double Schwarz-Christoffel conformal transformation. Perturbations in the temperature distribution due to the heat source and the chip finite length are evaluated as well as the temperature losses in the vicinity of the heat source. Explicit expressions of the normalized temperature and thermal input conductance are given and analyzed as a function of the source and chip relative dimensions.
Keywords
Circuits; Differential equations; Geometry; Heat sinks; Isothermal processes; Laplace equations; Silicon; Surface morphology; Temperature distribution; Thermal conductivity;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1974.17899
Filename
1477714
Link To Document