Title :
Chip-to-Chip Optical Link System Using an Optical Wiring Method
Author :
Cho, In-Kui ; Ahn, Seung Ho ; Rho, Byung Sup ; Chung, Kyo Seung ; Park, Hyo-Hoon
Author_Institution :
Electron. & Telecommun. Res. Inst., Daejeon
Abstract :
A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx). The optical TRx module consisted of a metal optical bench, a module printed circuit board, a driver/receiver integrated circuit, a vertical-cavity surface-emitting laser/photodiode array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. The optical wiring link was constructed with POFs mounted on a v-grooved polymethylmethacrylate bench. The data transfer measurements were presented successfully.
Keywords :
data communication; integrated optoelectronics; optical arrays; optical fibres; optical interconnections; optical polymers; photodetectors; photodiodes; plastics; printed circuits; surface emitting lasers; chip-to-chip optical link system; chip-to-chip-interconnection; data transfer measurements; driver-receiver integrated circuit; metal optical bench; optical interconnection; optical transmitter-receiver module; optical wiring method; photodiode array; plastic optical fiber; printed circuit board; v-grooved polymethylmethacrylate bench; vertical-cavity surface-emitting laser; Integrated optics; Optical arrays; Optical fiber communication; Optical fibers; Optical interconnections; Optical receivers; Optical transmitters; Printed circuits; Vertical cavity surface emitting lasers; Wiring; Chip-to-chip interconnect; optical fiber applications; optical fiber connecting; optical interconnections;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2007.901436
