• DocumentCode
    1047937
  • Title

    Improvement of CBRAM Resistance Window by Scaling Down Electrode Size in Pure-GeTe Film

  • Author

    Choi, Sang-Jun ; Lee, Jung-Hyun ; Bae, Hyung-Jin ; Yang, Woo-Young ; Kim, Tae-Wan ; Kim, Ki-Hong

  • Author_Institution
    Semicond. R&D Center, Samsung Electron. Co., Ltd., Yongin
  • Volume
    30
  • Issue
    2
  • fYear
    2009
  • Firstpage
    120
  • Lastpage
    122
  • Abstract
    TaN-pure-GeTe-Cu bipolar switching devices which can be adaptable to semiconductor processes were fabricated as a function of top-electrode sizes (0.2, 0.4, 10, and 50 mum). The on/off resistance change ratio increased highly with decreasing electrode size. In particular, the on/off resistance change ratio was about 103 when the electrode size was scaled down to 200 nm. We obtained the characteristics of conductive bridging memory cell using pure-GeTe film without any doping of Cu or Ag; we also determined the reason for the enhancement of the on/off resistance change ratio when scaling down the electrode size.
  • Keywords
    bipolar memory circuits; bridge circuits; copper; germanium compounds; random-access storage; switching circuits; tantalum compounds; CBRAM resistance window; TaN-GeTe-Cu; bipolar switching device; conductive bridging memory cell; electrode size; on-off resistance change ratio; random access memory; semiconductor fabrication process; size 0.2 mum; size 0.4 mum; size 10 mum; size 50 mum; Conductive bridging random access memory (CBRAM); Cu; GeTe; TaN; dry process; e-beam lithography; on/off ratio; scaling down;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2008.2009774
  • Filename
    4729644