Title :
A Three-Phase Current Reconstruction Technique Using Single DC Current Sensor Based on TSPWM
Author :
Haifeng Lu ; Xiaomeng Cheng ; Wenlong Qu ; Shuang Sheng ; Yituo Li ; Zhengyu Wang
Author_Institution :
Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
Abstract :
Three-phase current reconstruction technique using dc current information in conventional two-level inverters can be used for the purpose of cost reduction and sensor fault tolerance. A novel phase current reconstruction scheme, with reduced immeasurable area and common mode voltage, is proposed in this paper. A tristate pulse-width modulation technique has been employed, in which three adjacent switching states are used to construct the reference voltage. The active switching states are arranged at the edge and the center of a PWM cycle. Fixed sampling and simultaneous three-phase currents can be easily achieved with very little hardware and software requirements. A detailed analysis of the effects of nonidealities leads to regional modifications of the switching sequence resulting in almost the whole hexagon as the feasible area. The usefulness of the proposed reconstruction algorithm has been verified by experimental results obtained from a 4-kW induction motor drive system. Smooth transitions between the redundant and fault-tolerant modes were observed.
Keywords :
PWM invertors; cost reduction; electric sensing devices; fault tolerance; induction motor drives; signal reconstruction; PWM cycle; TSPWM; active switching state; adjacent switching state; common mode voltage; cost reduction; fault-tolerant mode; induction motor drive system; power 4 kW; redundant mode; sensor fault tolerance; single DC current sensor; three-phase current reconstruction technique; tristate pulse-width modulation technique; two-level inverter; Current measurement; Fault tolerance; Fault tolerant systems; Pulse width modulation; Switches; Vectors; Common-mode voltage; current reconstruction; fault tolerance; immeasurable area; single current sensor;
Journal_Title :
Power Electronics, IEEE Transactions on
DOI :
10.1109/TPEL.2013.2266408