DocumentCode
1048696
Title
Special issue on Compact Interconnect Models for Giga Scale Integration
Volume
30
Issue
1
fYear
2009
Firstpage
94
Lastpage
94
Abstract
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2008.2011592
Filename
4729716
Link To Document