• DocumentCode
    1048754
  • Title

    Design and Fabrication of Stretchable Multilayer Self-Aligned Interconnects for Flexible Electronics and Large-Area Sensor Arrays Using Excimer Laser Photoablation

  • Author

    Lin, Kevin L. ; Jain, Kunal

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL
  • Volume
    30
  • Issue
    1
  • fYear
    2009
  • Firstpage
    14
  • Lastpage
    17
  • Abstract
    Stretchable interconnects are fabricated on polymer substrates using metal patterns both as functional interconnect layers and as in situ masks for excimer laser photoablation. Single-layer and multilayer interconnects of various designs (rectilinear and ldquomeanderingrdquo) have been fabricated, and certain ldquomeanderingrdquo interconnect designs can be stretched up to 50% uniaxially while maintaining good electrical conductivity and structural integrity. This approach eliminates masks and microfabrication processing steps as compared to traditional fabrication approaches. Furthermore, this technology is scalable for large-area sensor arrays and electronic circuits, adaptable for a variety of materials and interconnects designs, and compatible with MEMS-based capacitive sensor technology.
  • Keywords
    electrical conductivity; flexible electronics; integrated circuit interconnections; laser ablation; multilayers; sensor arrays; MEMS-based capacitive sensor; electrical conductivity; excimer laser photoablation; flexible electronics; functional interconnect layers; in situ masks; large-area sensor arrays; metal patterns; polymer substrates; stretchable interconnects; stretchable multilayer self-aligned interconnects; structural integrity; Capacitive sensors; Conductivity; Flexible electronics; Integrated circuit interconnections; Nonhomogeneous media; Optical arrays; Optical design; Optical device fabrication; Polymers; Sensor arrays; Flexible electronics; MEMS; large-area sensor arrays; photoablation; stretchable interconnects;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2008.2008665
  • Filename
    4729722