DocumentCode
1048754
Title
Design and Fabrication of Stretchable Multilayer Self-Aligned Interconnects for Flexible Electronics and Large-Area Sensor Arrays Using Excimer Laser Photoablation
Author
Lin, Kevin L. ; Jain, Kunal
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL
Volume
30
Issue
1
fYear
2009
Firstpage
14
Lastpage
17
Abstract
Stretchable interconnects are fabricated on polymer substrates using metal patterns both as functional interconnect layers and as in situ masks for excimer laser photoablation. Single-layer and multilayer interconnects of various designs (rectilinear and ldquomeanderingrdquo) have been fabricated, and certain ldquomeanderingrdquo interconnect designs can be stretched up to 50% uniaxially while maintaining good electrical conductivity and structural integrity. This approach eliminates masks and microfabrication processing steps as compared to traditional fabrication approaches. Furthermore, this technology is scalable for large-area sensor arrays and electronic circuits, adaptable for a variety of materials and interconnects designs, and compatible with MEMS-based capacitive sensor technology.
Keywords
electrical conductivity; flexible electronics; integrated circuit interconnections; laser ablation; multilayers; sensor arrays; MEMS-based capacitive sensor; electrical conductivity; excimer laser photoablation; flexible electronics; functional interconnect layers; in situ masks; large-area sensor arrays; metal patterns; polymer substrates; stretchable interconnects; stretchable multilayer self-aligned interconnects; structural integrity; Capacitive sensors; Conductivity; Flexible electronics; Integrated circuit interconnections; Nonhomogeneous media; Optical arrays; Optical design; Optical device fabrication; Polymers; Sensor arrays; Flexible electronics; MEMS; large-area sensor arrays; photoablation; stretchable interconnects;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2008.2008665
Filename
4729722
Link To Document