• DocumentCode
    1048814
  • Title

    On the Formation of Positive Charges in Ultrathin Silicon-Oxynitride p-MOSFETs Subjected to Negative Bias Temperature Stress

  • Author

    Wang, Yangang

  • Author_Institution
    Liverpool John Moores Univ., Liverpool
  • Volume
    29
  • Issue
    3
  • fYear
    2008
  • fDate
    3/1/2008 12:00:00 AM
  • Firstpage
    269
  • Lastpage
    272
  • Abstract
    p-MOSFET negative bias temperature instability (NBTI) has become the most important reliability issue for the CMOS industry. This letter investigates the formation of oxide positive charges (PCs) and its effects on the NBTI. Evidence shows that PC dominates NBTI at stress temperature lower than 373 K, whereas interface-state generation has an obvious contribution above 373 K. Two kinds of PC are distinguished as follows: The trapped holes are the main origin of NBTI at lower temperatures, and the generated PC plays a role at higher temperatures. The physical mechanisms of the two kinds of PC are also discussed in this letter.
  • Keywords
    CMOS integrated circuits; MOSFET; hole traps; semiconductor device reliability; silicon compounds; thermal stability; thermal stresses; CMOS industry; NBTI; SiON; negative bias temperature instability; negative bias temperature stress; oxide positive charge formation; stress temperature; trapped holes; ultrathin silicon-oxynitride p-MOSFET; Degradation; hole traps; interface state; negative bias temperature instability (NBTI); oxynitride; positive charge (PC); recovery;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2008.915570
  • Filename
    4441348