DocumentCode :
1048814
Title :
On the Formation of Positive Charges in Ultrathin Silicon-Oxynitride p-MOSFETs Subjected to Negative Bias Temperature Stress
Author :
Wang, Yangang
Author_Institution :
Liverpool John Moores Univ., Liverpool
Volume :
29
Issue :
3
fYear :
2008
fDate :
3/1/2008 12:00:00 AM
Firstpage :
269
Lastpage :
272
Abstract :
p-MOSFET negative bias temperature instability (NBTI) has become the most important reliability issue for the CMOS industry. This letter investigates the formation of oxide positive charges (PCs) and its effects on the NBTI. Evidence shows that PC dominates NBTI at stress temperature lower than 373 K, whereas interface-state generation has an obvious contribution above 373 K. Two kinds of PC are distinguished as follows: The trapped holes are the main origin of NBTI at lower temperatures, and the generated PC plays a role at higher temperatures. The physical mechanisms of the two kinds of PC are also discussed in this letter.
Keywords :
CMOS integrated circuits; MOSFET; hole traps; semiconductor device reliability; silicon compounds; thermal stability; thermal stresses; CMOS industry; NBTI; SiON; negative bias temperature instability; negative bias temperature stress; oxide positive charge formation; stress temperature; trapped holes; ultrathin silicon-oxynitride p-MOSFET; Degradation; hole traps; interface state; negative bias temperature instability (NBTI); oxynitride; positive charge (PC); recovery;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2008.915570
Filename :
4441348
Link To Document :
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