DocumentCode
1048814
Title
On the Formation of Positive Charges in Ultrathin Silicon-Oxynitride p-MOSFETs Subjected to Negative Bias Temperature Stress
Author
Wang, Yangang
Author_Institution
Liverpool John Moores Univ., Liverpool
Volume
29
Issue
3
fYear
2008
fDate
3/1/2008 12:00:00 AM
Firstpage
269
Lastpage
272
Abstract
p-MOSFET negative bias temperature instability (NBTI) has become the most important reliability issue for the CMOS industry. This letter investigates the formation of oxide positive charges (PCs) and its effects on the NBTI. Evidence shows that PC dominates NBTI at stress temperature lower than 373 K, whereas interface-state generation has an obvious contribution above 373 K. Two kinds of PC are distinguished as follows: The trapped holes are the main origin of NBTI at lower temperatures, and the generated PC plays a role at higher temperatures. The physical mechanisms of the two kinds of PC are also discussed in this letter.
Keywords
CMOS integrated circuits; MOSFET; hole traps; semiconductor device reliability; silicon compounds; thermal stability; thermal stresses; CMOS industry; NBTI; SiON; negative bias temperature instability; negative bias temperature stress; oxide positive charge formation; stress temperature; trapped holes; ultrathin silicon-oxynitride p-MOSFET; Degradation; hole traps; interface state; negative bias temperature instability (NBTI); oxynitride; positive charge (PC); recovery;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2008.915570
Filename
4441348
Link To Document