Title :
Crosstalk modeling for coupled RLC interconnects with application to shield insertion
Author :
Zhang, Junmou ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rochester Univ., NY
fDate :
6/1/2006 12:00:00 AM
Abstract :
On-chip interconnect delay and crosstalk noise have become significant bottlenecks in the performance and signal integrity of deep submicrometer VLSI circuits. A crosstalk noise model for both identical and nonidentical coupled resistance-inductance-capacitance (RLC) interconnects is developed based on a decoupling technique exhibiting an average error of 6.8% as compared to SPICE. The crosstalk noise model, together with a proposed concept of effective mutual inductance, is applied to evaluate the effectiveness of the shielding technique
Keywords :
RLC circuits; VLSI; crosstalk; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; crosstalk noise; deep sub-micrometer VLSI circuits; inductive coupling; on-chip interconnect delay; resistance-inductance-capacitance interconnects; shield insertion; signal integrity; Coupling circuits; Crosstalk; Delay effects; Integrated circuit interconnections; Modal analysis; Mutual coupling; RLC circuits; Routing; Transmission line matrix methods; Very large scale integration; Capacitive coupling; crosstalk analysis; decoupling technique; inductive coupling; resistance–inductance–capacitance (RLC) interconnect; shield insertion;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2006.878223
