Title :
Power Device Packaging Technologies for Extreme Environments
Author :
Johnson, R. Wayne ; Wang, Cai ; Liu, Yi ; Scofield, James D.
Author_Institution :
Electr. & Comput. Eng. Dept., Auburn Univ., Auburn, AL
fDate :
7/1/2007 12:00:00 AM
Abstract :
Silicon carbide is a wide-bandgap semiconductor capable of operation at temperatures in excess of 300degC. However, high-temperature packaging to interface with the other elements of the electrical system is required. Die attach, wire bonding, and passivation materials and techniques have been demonstrated for use at 300degC. Transient liquid phase bonding has been developed with Au:Sn/Au, yielding high die shear strength after 2000 h at 400degC. Large diameter (250 mum) gold and platinum wire bonding was evaluated for top side electrical contact. Au wire was reliable after 2000 h at 300degC with Ti/Ti:W/Au pads over passivation on the SiC. However, Au wire on Ti/Pt/Au and Pt wire on both Ti/Tl:W/Au and Ti/Pt/Au exhibited passivation fracture with aging. Polyimide has been demonstrated for 2000 h at 300degC in air as a high-voltage passivation layer.
Keywords :
ageing; electrical contacts; fracture; gold; high-temperature electronics; lead bonding; passivation; platinum; polymer films; power semiconductor devices; semiconductor device packaging; semiconductor device reliability; silicon compounds; thallium; thermal management (packaging); titanium; tungsten; wide band gap semiconductors; SiC; Ti-Pt-Au; Ti-Tl:W-Au; die attach; die shear strength; electrical contact; electrical system; high-temperature packaging; passivation fracture; passivation materials; power device packaging technologies; silicon carbide; size 250 mum; temperature 300 C; temperature 400 C; time 2000 h; transient liquid phase bonding; wide-bandgap semiconductor; wire bonding; Bonding; Gold; Microassembly; Passivation; Platinum; Semiconductor device packaging; Semiconductor materials; Silicon carbide; Temperature; Wire; Die attach; high-temperature aging; passivation; wire bonding;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2007.899158
