DocumentCode
1049035
Title
Predicting Wafer-Lot Output Time With a Hybrid FCM–FBPN Approach
Author
Chen, Toly
Author_Institution
Feng Chia Univ., Taichung
Volume
37
Issue
4
fYear
2007
Firstpage
784
Lastpage
793
Abstract
Output-time prediction is a critical task to a wafer fab. To further enhance the accuracy of wafer-lot output-time prediction, the concept of input classification is applied to Chen´s fuzzy backpropagation network (FBPN) approach in this paper by preclassifying wafer lots with the fuzzy c-means (FCM) classifier before predicting the output times. In this way, similar wafer lots are clustered in the same category. The data of wafer lots of different categories are then learned with different FBPNs but with the same topology. After learning, these FBPNs form an FBPN ensemble that can be applied in predicting the output time of a new lot. The output of the FBPN ensemble determines the cycle/output time forecast and is obtained by aggregating the outputs of the component FBPNs. Production simulation is applied in this paper to generate test data. According to experimental results, the prediction accuracy of the hybrid FCM-FBPN approach was significantly better than those of many existing approaches.
Keywords
backpropagation; fuzzy neural nets; integrated circuit manufacture; pattern classification; fuzzy backpropagation network; fuzzy c-means classifier; hybrid FCM-FBPN approach; production simulation; wafer lot preclassification; wafer-lot output time prediction; wafer-lot output-time prediction; Accuracy; Backpropagation; Databases; Engineering management; Industrial engineering; Input variables; Predictive models; Production; Testing; Topology; Fuzzy backpropagation network (FBPN); fuzzy c-means (FCM); output-time prediction; wafer fab; Algorithms; Computer Simulation; Fuzzy Logic; Industry; Models, Theoretical; Neural Networks (Computer); Semiconductors; Task Performance and Analysis;
fLanguage
English
Journal_Title
Systems, Man, and Cybernetics, Part B: Cybernetics, IEEE Transactions on
Publisher
ieee
ISSN
1083-4419
Type
jour
DOI
10.1109/TSMCB.2007.895364
Filename
4267853
Link To Document