DocumentCode
1049693
Title
Chip-level waveguide-mirror-pillar optical interconnect structure
Author
Ogunsola, O.O. ; Thacker, H.D. ; Bachim, B.L. ; Bakir, M.S. ; Pikarsky, J. ; Gaylord, T.K. ; Meindl, J.D.
Author_Institution
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA
Volume
18
Issue
15
fYear
2006
Firstpage
1672
Lastpage
1674
Abstract
Waveguides, mirrors, and polymer pillars can be integrated together to provide optical interconnects to the chip level. Total internal reflection in the polymer pillar provides a high level of spatial confinement of the light. The metallized mirror terminating the waveguide may be at 45deg or at a nearby angle such as 54.74deg (anisotropically etched silicon) and produce nearly equal coupling efficiencies. For a polymer waveguide, a gold mirror, and a polymer pillar of the dimensions fabricated, the simulated coupling efficiencies are 80.7% or 0.93 dB (45deg mirror) and 82.5% or 0.84 dB (54.74deg mirror), respectively. These simulations together with the fabrication and testing of a 54.74deg mirror configuration demonstrates the viability of the waveguide-mirror-pillar structure, its insensitivity to mirror angle, and its compatibility with current substrate fabrication technologies
Keywords
gold; integrated optics; mirrors; optical couplers; optical fabrication; optical interconnections; optical polymers; optical testing; optical waveguides; chip level; gold mirror; optical fabrication; optical interconnect; optical testing; polymer pillar; polymer waveguide; total internal reflection; Anisotropic magnetoresistance; Etching; Metallization; Mirrors; Optical device fabrication; Optical interconnections; Optical polymers; Optical reflection; Optical waveguides; Silicon; Finite-difference time-domain (FDTD); mirrors; optical interconnects; optical waveguides; polymer pillars;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2006.879533
Filename
1661686
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