• DocumentCode
    1049693
  • Title

    Chip-level waveguide-mirror-pillar optical interconnect structure

  • Author

    Ogunsola, O.O. ; Thacker, H.D. ; Bachim, B.L. ; Bakir, M.S. ; Pikarsky, J. ; Gaylord, T.K. ; Meindl, J.D.

  • Author_Institution
    Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA
  • Volume
    18
  • Issue
    15
  • fYear
    2006
  • Firstpage
    1672
  • Lastpage
    1674
  • Abstract
    Waveguides, mirrors, and polymer pillars can be integrated together to provide optical interconnects to the chip level. Total internal reflection in the polymer pillar provides a high level of spatial confinement of the light. The metallized mirror terminating the waveguide may be at 45deg or at a nearby angle such as 54.74deg (anisotropically etched silicon) and produce nearly equal coupling efficiencies. For a polymer waveguide, a gold mirror, and a polymer pillar of the dimensions fabricated, the simulated coupling efficiencies are 80.7% or 0.93 dB (45deg mirror) and 82.5% or 0.84 dB (54.74deg mirror), respectively. These simulations together with the fabrication and testing of a 54.74deg mirror configuration demonstrates the viability of the waveguide-mirror-pillar structure, its insensitivity to mirror angle, and its compatibility with current substrate fabrication technologies
  • Keywords
    gold; integrated optics; mirrors; optical couplers; optical fabrication; optical interconnections; optical polymers; optical testing; optical waveguides; chip level; gold mirror; optical fabrication; optical interconnect; optical testing; polymer pillar; polymer waveguide; total internal reflection; Anisotropic magnetoresistance; Etching; Metallization; Mirrors; Optical device fabrication; Optical interconnections; Optical polymers; Optical reflection; Optical waveguides; Silicon; Finite-difference time-domain (FDTD); mirrors; optical interconnects; optical waveguides; polymer pillars;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2006.879533
  • Filename
    1661686