Title :
Fully elastic interconnects on nanopatterned elastomeric substrates
Author :
Mandlik, Prashant ; Lacour, Stéphanie P. ; Li, Jason W. ; Chou, Stephen Y. ; Wagner, Sigurd
Author_Institution :
Dept. of Electr. Eng., Princeton Univ., NJ
Abstract :
Elastically stretchable metal interconnects are required for electronic skin. To date, the resistance of such thin-film interconnects has been found to increase much more with mechanical strain than expected from purely geometrical deformation of the conductor. It has been discovered that the resistance change due to fully elastic deformation is minimal when the metal films are deposited on pyramidal nanopatterned surfaces. The nanopattern constrains the film to purely elastic deformation by localizing the microcracks that are formed in the conductor during stretching. Between 0% and 25% mechanical strain, the electrical resistance increases by only 60%, which is in close agreement with purely geometric deformation
Keywords :
elastic deformation; elastomers; integrated circuit interconnections; microcracks; nanostructured materials; thin film circuits; electronic skin; fully elastic deformation; fully elastic interconnects; geometrical deformation; mechanical strain; microcracks; nanopattern constrains; nanopatterned elastomeric substrates; pyramidal nanopatterned surfaces; resistance change; thin film interconnects; Capacitive sensors; Conductive films; Conductors; Electric resistance; Immune system; Integrated circuit interconnections; Materials science and technology; Nanopatterning; Skin; Substrates; Flexible structures; nanotechnology; silicone rubber; thin-film circuit interconnections;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2006.879029
