• DocumentCode
    1050602
  • Title

    Multijunction AC or DC integrated GaP light emitting diode array

  • Author

    Spitzer, Stuart M. ; Schumaker, Norman E. ; Koszi, Louis A. ; North, James C.

  • Author_Institution
    Bell Laboratories, Murray Hill, N. J.
  • Volume
    22
  • Issue
    9
  • fYear
    1975
  • fDate
    9/1/1975 12:00:00 AM
  • Firstpage
    701
  • Lastpage
    706
  • Abstract
    An ac or dc GaP LED array has been designed and fabricated which has potential as a direct replacement for several tungsten filament lamps and as an illuminator for new design considerations. In designing such an LED for high-voltage application, series light emitting junctions rather than series resistors are used as a voltage divider to maximize the light output/power input ratio. A figure of merit is modeled and calculated which provides a measure of total light output for a given applied current and voltage as a function of the number of series diodes. The optimum number of series diode for a given ac voltage is Vrms/1.94. Thermal calculations based upon chip size, power dissipation, and thermal contact resistance predict a peak temperature rise of 30°C for the bonded die approach. n- and p-type liquid phase epitaxial layers were grown on semi-insulating substrates, p-n junctions on the same chip were electrically isolated utilizing either proton bombardment or chemically etched trenches. An Au metallization scheme provides the series-parallel interconnection required for ac or dc operation while maintaining junction isolation. The light emitting junction areas are mesas, with edges shaped to redirect internally generated light out to the viewer. The near field radiation pattern demonstrates the optical effectiveness of the shaped-mesa emitters.
  • Keywords
    Contact resistance; Current measurement; Light emitting diodes; Optical arrays; Power dissipation; Resistors; Semiconductor device measurement; Thermal resistance; Tungsten; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1975.18206
  • Filename
    1478041