• DocumentCode
    1051889
  • Title

    Physics of Hole Transport in Strained Silicon MOSFET Inversion Layers

  • Author

    Wang, Everett X. ; Matagne, Philippe ; Shifren, Lucian ; Obradovic, Borna ; Kotlyar, Roza ; Cea, Stephen ; Stettler, Mark ; Giles, Martin D.

  • Author_Institution
    DTS Div., Intel Corp., Santa Clara, CA
  • Volume
    53
  • Issue
    8
  • fYear
    2006
  • Firstpage
    1840
  • Lastpage
    1851
  • Abstract
    A comprehensive quantum anisotropic transport model for holes was used to study silicon PMOS inversion layer transport under arbitrary stress. The anisotropic band structures of bulk silicon and silicon under field confinement as a twodimensional quantum gas are computed using the pseudopotential method and a six-band stress-dependent k.p Hamiltonian. Anisotropic scattering is included in the momentum-dependent scattering rate calculation. Mobility is obtained from the Kubo-Greenwood formula at low lateral field and from the fullband Monte Carlo simulation at high lateral field. Using these methods, a comprehensive study has been performed for both uniaxial and biaxial stresses. The results are compared with device bending data and piezoresistance data for uniaxial stress, and device data from strained Si channel on relaxed SiGe substrate devices for biaxial tensile stress. All comparisons show a very good agreement with simulation. It is found that the hole band structure is dominated by 12 "wings," where mechanical stress, as well as the vertical field under certain stress conditions, can alter the energies of the few lowest hole subbands, changing the transport effective mass, density-of-states, and scattering rates, and thus affecting the mobility
  • Keywords
    MOSFET; Monte Carlo methods; elemental semiconductors; hole mobility; inversion layers; semiconductor device models; silicon; stress effects; Hamiltonian method; Kubo-Greenwood formula; MOSFET inversion layer; Monte Carlo simulation; Si; anisotropic band structures; anisotropic scattering; biaxial stress; biaxial tensile stress; bulk silicon; device bending data; field confinement; hole mobility; hole transport; piezoresistance data; quantum anisotropic transport; scattering rate calculation; silicon PMOS inversion layer; strained silicon; uniaxial stress; Anisotropic magnetoresistance; Effective mass; Germanium silicon alloys; MOSFET circuits; Particle scattering; Physics; Piezoresistive devices; Quantum computing; Silicon germanium; Tensile stress; Hole mobility; MOSFETs; SiGe; modeling; strain; strained silicon; stress;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2006.877370
  • Filename
    1661886