DocumentCode :
1051992
Title :
Extraction of the Inversion and Accumulation Layer Mobilities in n-Channel Trench DMOSFETs
Author :
Ng, Jacky C W ; Sin, Johnny K O
Author_Institution :
Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol.
Volume :
53
Issue :
8
fYear :
2006
Firstpage :
1914
Lastpage :
1921
Abstract :
A new method to extract both the inversion and accumulation layer mobilities of electrons in n-channel trench double-diffused MOSFETs (DMOSFETs) is proposed and implemented for the first time. First, a model is developed for the on-resistance of the n-channel trench DMOSFET. This on-resistance model is fitted to the experimental data measured from an experimental n-channel trench DMOSFET by the method of linear least squares fitting. A very good fit is obtained such that the average percentage error between the model curve and the experimental on-resistance is less than plusmn1%. The fitting parameters obtained are used to calculate the inversion and accumulation layer mobilities as a function of a wide range of effective electric field. The calculated mobilities agree with those previously reported for conventional MOSFETs. The results are useful for optimizing the performance and reliability of the trench DMOSFETs
Keywords :
MOSFET; accumulation layers; curve fitting; electron mobility; inversion layers; least squares approximations; semiconductor device models; accumulation layer mobility; double-diffused MOSFET; effective electric field; fitting parameters; inversion layer mobility; linear least squares fitting; n-channel trench DMOSFET; Current measurement; Data mining; Electric resistance; Electron mobility; Etching; Least squares methods; MOSFET circuits; Power transistors; Silicon compounds; Testing; Accumulation layer mobility; inversion layer mobility; modeling; trench double-diffused MOSFET (DMOSFET);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2006.877871
Filename :
1661895
Link To Document :
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