Design of miniaturized RF SAW duplexer package

Author

Dong, Hao ; Wu, Thomas X. ; Cheema, Kamran S. ; Abbott, Benjamin P. ; Finch, Craig A. ; Foo, Hanna

Author_Institution

Dept. of Electr. & Comput. Eng., Central Florida Univ., Orlando, FL, USA

Volume

51

Issue

7

fYear

2004

fDate

7/1/2004 12:00:00 AM

Firstpage

849

Lastpage

858

Abstract

This paper provides a comprehensive methodology for accurate analysis and design of miniaturized radio frequency (RF) surface acoustic wave (SAW) duplexer package. Full-wave analysis based on the three dimensional (3-D) finite element method (FEM) is applied to get the package model. The die model. is obtained by combining the parasitics and acoustics models. The modeling of bonding wire is also discussed. The models of package, die, and bonding wires are assembled together to get the total response. Based on this methodology, several novel ideas are proposed to significantly improve the isolation. Simulation and measurement results are compared, and excellent agreement is found. The technique developed in this paper reduces the design cycle time greatly and can be applied to various RF SAW device packages.

Keywords

finite element analysis; lead bonding; packaging; radiofrequency filters; surface acoustic wave filters; 3D-FEM; acoustics model; bonding wire modeling; miniaturized RF SAW duplexer package design; package models; parasitics model; surface acoustic wave duplexer package; three dimensional finite element method; Acoustic measurements; Acoustic waves; Assembly; Bonding; Finite element methods; Packaging; Radio frequency; Surface acoustic wave devices; Surface acoustic waves; Wire;

fLanguage

English

Journal_Title

Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on

Publisher

ieee

ISSN

0885-3010

Type

jour

DOI

10.1109/TUFFC.2004.1320744

Filename

1320744