Title :
A capacitance ultrasonic transducer for high-temperature applications
Author :
Schröder, Andreas ; Harasek, Stefan ; Kupnik, Mario ; Wiesinger, Michael ; Gornik, Erich ; Benes, Ewald ; Gröschl, Martin
Author_Institution :
Inst. for Solid State Electron., Vienna Univ. of Technol., Wien, Austria
fDate :
7/1/2004 12:00:00 AM
Abstract :
This paper introduces a novel Ultrasonic capacitance transducer for operation at elevated gas temperatures of several hundred degrees Celsius. The transducer design is based on a metallic membrane foil and a backplate made of an electrically conducting substrate coated with an insulation layer. Guidelines are given for selecting suitable materials for the membrane foil, the backplate substrate, and the coating. Manufacturing techniques applied for fabrication of different transducer types are described in detail. Transducers tested were composed of titanium substrates with insulation layers of silicon nitride or of silicon substrates with silicon oxide coatings. Experimental setup and test procedures are described. Results of transducer characterization and performance tests at elevated temperatures are presented and discussed. Transducer functionality is proven for air temperatures of up to 500/spl deg/C.
Keywords :
capacitive sensors; electric breakdown; electric resistance; micromachining; oxidation; photolithography; plasma CVD; silicon compounds; sputter etching; thermal expansion; ultrasonic transducers; Si; Si/sub 3/N/sub 4/; SiO/sub 2/; Ti; back-plate; capacitance ultrasonic transducer; electrically conducting substrate; elevated gas temperatures; high-temperature applications; insulation layer coating; metallic membrane foil; silicon nitride insulation layers; silicon oxide coatings; silicon substrates; titanium substrates; transducer fabrication; transducers testing; Biomembranes; Capacitance; Coatings; Conducting materials; Dielectrics and electrical insulation; Guidelines; Silicon; Temperature; Testing; Ultrasonic transducers;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
DOI :
10.1109/TUFFC.2004.1320750