Title :
Introduction to the Special Issue on Failure Analysis of Integrated Circuit Devices and Packages
fDate :
3/1/2007 12:00:00 AM
Abstract :
The four articles in this special issue focus on failure analysis of integrated circuit devices and packages. The articles are briefly summarized here.
Keywords :
Chip scale packaging; Communication switching; Dielectric materials; Failure analysis; Integrated circuit interconnections; Integrated circuit packaging; Optical switches; Scanning electron microscopy; Special issues and sections; Thermal conductivity;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2007.900059
