DocumentCode :
1053962
Title :
Introduction to the Special Issue on the 2006 International Reliability Physics Symposium
Author :
Suehle, J. S. ; Cheung, K. P. ; Spinelli, Almir
Volume :
7
Issue :
1
fYear :
2007
fDate :
3/1/2007 12:00:00 AM
Firstpage :
50
Lastpage :
50
Abstract :
The 12 papers in this special issue are extensions of presentations given at the 44th Annual IEEE International Reliability Physics Symposium (IRPS), held in San Jose, CA, on March 26-30, 2006. The diverse set of papers include studies in assembly and packaging reliability, interconnect reliability, latchup, product reliability, soft error rate, memory reliability, process-induced damage, and transistor reliability. The papers are briefly summarized here.
Keywords :
Assembly; Dielectrics; Error analysis; Materials reliability; Niobium compounds; Packaging; Physics; Semiconductor device modeling; Special issues and sections; Titanium compounds;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2007.901137
Filename :
4271490
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1053962
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