Title :
Application of TOFSIMS for Contamination Issues in the Assembly World
Author :
Pathangey, Balu ; Proctor, Andrew ; Wang, Zhiyong ; Fu, Zezhong ; Tanikella, Ravindra
Author_Institution :
Intel Corp., Chandler
fDate :
3/1/2007 12:00:00 AM
Abstract :
Within the assembly world, problems related to package contamination, which stem from material sourcing and assembly process excursions, can impact product reliability. From the reliability perspective, it is essential to achieve integrity at all internal interfaces in the flip-chip, wire-bond, and novel mixed technology packages. In many instances, both organic and low-level ionic contaminants have resulted in interface delamination, metal migration, microcracking, etc., which leads to a premature failure of products either in reliability tests or in the field. Several examples of failure analysis relating to package contamination in the assembly world and the effectiveness of time-of-flight secondary ion mass spectroscopy in isolating and understanding failures are highlighted in this paper.
Keywords :
chip scale packaging; failure analysis; flip-chip devices; integrated circuit reliability; secondary ion mass spectra; surface contamination; time of flight mass spectra; TOFSIMS; assembly process excursions; flip-chip; interface delamination; low-level ionic contaminants; material sourcing; metal migration; microcracking; mixed technology packages; organic contaminants; package contamination; premature product failure; product reliability; time-of-flight secondary ion mass spectroscopy; wire-bond; Assembly; Chemical analysis; Chemical elements; Delamination; Failure analysis; Mass spectroscopy; Materials reliability; Packaging; Scanning electron microscopy; Surface contamination; Assembly; BHAST; TOFSIMS; contamination; delamination; interface; reliability;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2007.900057
