DocumentCode
1054157
Title
Why Waste Time on Roadmaps When We Don´t Have Cars?
Author
Vallett, David P.
Author_Institution
Div. of IBM Global Eng. Solutions, Essex Junction
Volume
7
Issue
1
fYear
2007
fDate
3/1/2007 12:00:00 AM
Firstpage
5
Lastpage
10
Abstract
Reliability and yield depend on timely accurate failure analysis (FA). While scaling and new materials continue to drive integrated circuit performance, key areas of analytical technology remain largely stagnant. FA roadmaps and whitepapers detail major challenges facing the industry, but research, development, and tool commercialization are languid. Unlike the mainstream activities of design, manufacturing, and test, FA suffers from a loss of focus, a lack of funding, and a small commercial market. After a review of major shortcomings in analytical capability, this paper will discuss barriers to analytical technology development and propose alternatives for providing a more fertile infrastructure for requisite research and development.
Keywords
failure analysis; research and development; semiconductor device manufacture; failure analysis; research and development; tool commercialization; Automotive materials; Circuit testing; Commercialization; Failure analysis; Integrated circuit reliability; Integrated circuit technology; Integrated circuit yield; Manufacturing industries; Performance analysis; Research and development; Failure analysis (FA); R&D planning; research and development (R&D) management;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2007.899666
Filename
4271510
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