DocumentCode :
105420
Title :
Ion-Beam-Assisted Deposition of Mo Thin Films for TES Applications
Author :
Morgan, Kelsey ; Jaeckel, Felix T. ; Kripps, Kari Lynn ; McCammon, Dan
Author_Institution :
Univ. of Wisconsin-Madison, Madison, WI, USA
Volume :
25
Issue :
3
fYear :
2015
fDate :
Jun-15
Firstpage :
1
Lastpage :
5
Abstract :
Molybdenum/nonsuperconducting metal bilayers form the basis for many high-performance superconducting transition-edge sensors. The low-stress high-density molybdenum films required for this application are usually produced with sputter deposition or evaporation onto a heated substrate to keep the surface mobility of adatoms sufficiently high. However, reproducible and uniform superconducting transition temperatures are difficult to achieve via either technique. As an alternative, we are exploring the use of low-energy (50-150 eV) Ar ion assisted e-beam evaporation to provide an energy/momentum input that can be tuned to optimize film quality. We present measurements of stress, resistivity, and transition temperature of thin (40-100 nm) Mo films deposited over a range of conditions.
Keywords :
ion beam assisted deposition; molybdenum; multilayers; photodetectors; sputter deposition; superconducting transition temperature; thin films; vacuum deposition; Mo; TES application; electron volt energy 50 eV to 150 eV; energy-momentum input; evaporation deposition; heated substrate; high performance superconducting transition edge sensors; ion beam assisted deposition; low stress high density molybdenum film; molybdenum thin films; molybdenum-nonsuperconducting metal bilayers; size 40 nm to 100 nm; sputter deposition; superconducting transition temperature; surface mobility; Annealing; Conductivity; Films; Stress; Superconducting films; Superconducting transition temperature; Temperature measurement; Superconducting thin films; Thin films; X-ray detectors; thin films;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2014.2384994
Filename :
6994806
Link To Document :
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