Title :
Passive self-aligned low-cost packaging of semiconductor laser arrays on Si motherboard
Author :
Hunziker, W. ; Vogt, W. ; Melchior, H. ; Buchmann, P. ; Vettiger, P.
Author_Institution :
Inst. for Quantum Electron., Swiss Federal Inst. of Technol., Zurich, Switzerland
Abstract :
A passive, self-aligned packaging technique for semiconductor laser arrays has been realized. Alignment trenches on the laser chip are used for self-alignment during flip-chip mounting on a silicon motherboard. The use of the etched Si sidewalls for alignment results in a self-positioning effect, reducing the necessary device placing precision, and allowing for large tolerances in the motherboard processing, resulting in low packaging costs. A module with four lasers and integrated monitor diodes has been pigtailed with multimode fibers. Optical mounting excess and differential losses between the channels are <0.5 dB.<>
Keywords :
flip-chip devices; integrated circuit packaging; integrated optoelectronics; optical interconnections; optical losses; semiconductor laser arrays; silicon; 0.5 dB; Si; Si motherboard; alignment trenches; device placing precision; differential losses; etched Si sidewalls; flip-chip mounting; integrated monitor diodes; large tolerances; laser chip; low packaging costs; multimode fiber pigtailing; optical mounting excess; passive self-aligned low-cost packaging; self-aligned packaging technique; self-alignment; self-positioning effect; semiconductor laser arrays; Costs; Etching; Fiber lasers; Monitoring; Optical arrays; Semiconductor device packaging; Semiconductor diodes; Semiconductor laser arrays; Semiconductor lasers; Silicon;
Journal_Title :
Photonics Technology Letters, IEEE
