DocumentCode :
1054457
Title :
Spatial position of deep levels near the Si—SiO2interface of ion implanted MOS structures
Author :
Runge, Hartmut
Author_Institution :
Siemens AG, ZFE, Postfach, München
Volume :
23
Issue :
11
fYear :
1976
fDate :
11/1/1976 12:00:00 AM
Firstpage :
1233
Lastpage :
1236
Abstract :
Measurements of the threshold voltage shift of MOS transistors in dependence on the implantation energy are correlated with calculations of the number of ions implanted in a small Si-layer beneath the gate oxide. The thickness of this layer and the number of deep levels per implanted ion is determined. The energy level ETof the implanted35Cl+in the silicon is approximately 0.85 eV below the conduction band.
Keywords :
Annealing; Bridge circuits; Energy states; Extrapolation; Helium; Interface states; Ion implantation; MOSFETs; Silicon; Threshold voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1976.18584
Filename :
1478597
Link To Document :
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