DocumentCode
1054665
Title
The control of channeling phenomenon
Author
Shibata, Takeshi ; Hashimoto, Hiroshi ; Hirakawa, Tadahiko ; Tonari, Kazuhiko
Author_Institution
Process & Manuf. Eng. Center, Toshiba Corp., Yokohama, Japan
Volume
17
Issue
3
fYear
2004
Firstpage
299
Lastpage
304
Abstract
The dependence of depth profile on a tilt and twist angle was investigated with a resolution of 0.05° using a stencil mask ion implanter that has less than 0.1° parallelism of ion beam. Angular dependence of depth profiles obtained by secondary ion mass spectrometry (SIMS) shows the channeling phenomenon can be controlled using a highly controlled parallel ion beam. This means that if tilt angle is controlled with a resolution of less than 0.1°, the variation caused by channeling phenomenon can be neglected. The threshold voltage data of n-type MOSFETs fabricated using a controlled parallel ion beam with resolution of less than 0.1° indicates that the variation is the same as that in the case of one fabricated using 7° implantation.
Keywords
MOSFET; boron; channelling; ion implantation; secondary ion mass spectra; silicon; substrates; SIMS; Si:B; channeling phenomenon; controlled parallel ion beam; depth profile; n type MOSFET; secondary ion mass spectrometry; stencil mask ion implantation; threshold voltage data; tilt angle; twist angle; Electric variables; Ion beams; Ion implantation; MOSFETs; Optical collimators; Parallel processing; Semiconductor devices; Threshold voltage; Voltage control; Weight control; Channeling; implantation; stencil mask ion implanter; threshold voltage;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2004.831929
Filename
1321126
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