Title :
Preface to the Special Section on Electromigration Published in March 2009
Author :
Ceric, H. ; Selberherr, Siegfried
fDate :
6/1/2009 12:00:00 AM
Abstract :
The three papers in this special section were originally presented at the Workshop on Electromigration Reliability, hosted in 2007 in Vienna, Austria. This section was published in the March 2009 issue, but the preface could not be included at the time of publication.
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2009.2020086
