• DocumentCode
    1054876
  • Title

    Preface to the Special Section on Electromigration Published in March 2009

  • Author

    Ceric, H. ; Selberherr, Siegfried

  • Volume
    9
  • Issue
    2
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    103
  • Lastpage
    103
  • Abstract
    The three papers in this special section were originally presented at the Workshop on Electromigration Reliability, hosted in 2007 in Vienna, Austria. This section was published in the March 2009 issue, but the preface could not be included at the time of publication.
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2009.2020086
  • Filename
    5062530
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1054876