DocumentCode
105552
Title
Controlled reactive ion etching and plasma regrowth of titanium oxides of known thickness for production of metal-oxide-metal diodes
Author
Dodd, Linzi E. ; Gallant, Andrew J. ; Wood, David
Author_Institution
Sch. of Eng. & Comput. Sci., Durham Univ., Durham, UK
Volume
8
Issue
8
fYear
2013
fDate
Aug-13
Firstpage
476
Lastpage
478
Abstract
The successful production, via two different oxidation processes, of metal-oxide-metal (MOM) diodes is presented. An innovative reactive ion etching and plasma assisted regrowth process has been used to provide oxides, which are in the thickness range 4.0-5.1 nm. These are thinner and physically more uniform than oxides grown in a furnace, resulting in diodes which should conduct via electron tunnelling across the MOM junction. Transmission electron microscopy analysis has been used in conjunction with time of flight secondary ion mass spectrometry analysis to verify oxide thickness and uniformity.
Keywords
semiconductor diodes; sputter etching; transmission electron microscopy; tunnelling; MOM junction; controlled reactive ion etching; electron tunnelling; metal-oxide-metal diodes; oxidation process; oxide thickness; plasma assisted regrowth process; size 4 nm to 5.1 nm; time of flight secondary ion mass spectrometry analysis; titanium oxides; transmission electron microscopy analysis;
fLanguage
English
Journal_Title
Micro & Nano Letters, IET
Publisher
iet
ISSN
1750-0443
Type
jour
DOI
10.1049/mnl.2013.0177
Filename
6587992
Link To Document