• DocumentCode
    105552
  • Title

    Controlled reactive ion etching and plasma regrowth of titanium oxides of known thickness for production of metal-oxide-metal diodes

  • Author

    Dodd, Linzi E. ; Gallant, Andrew J. ; Wood, David

  • Author_Institution
    Sch. of Eng. & Comput. Sci., Durham Univ., Durham, UK
  • Volume
    8
  • Issue
    8
  • fYear
    2013
  • fDate
    Aug-13
  • Firstpage
    476
  • Lastpage
    478
  • Abstract
    The successful production, via two different oxidation processes, of metal-oxide-metal (MOM) diodes is presented. An innovative reactive ion etching and plasma assisted regrowth process has been used to provide oxides, which are in the thickness range 4.0-5.1 nm. These are thinner and physically more uniform than oxides grown in a furnace, resulting in diodes which should conduct via electron tunnelling across the MOM junction. Transmission electron microscopy analysis has been used in conjunction with time of flight secondary ion mass spectrometry analysis to verify oxide thickness and uniformity.
  • Keywords
    semiconductor diodes; sputter etching; transmission electron microscopy; tunnelling; MOM junction; controlled reactive ion etching; electron tunnelling; metal-oxide-metal diodes; oxidation process; oxide thickness; plasma assisted regrowth process; size 4 nm to 5.1 nm; time of flight secondary ion mass spectrometry analysis; titanium oxides; transmission electron microscopy analysis;
  • fLanguage
    English
  • Journal_Title
    Micro & Nano Letters, IET
  • Publisher
    iet
  • ISSN
    1750-0443
  • Type

    jour

  • DOI
    10.1049/mnl.2013.0177
  • Filename
    6587992