DocumentCode :
105552
Title :
Controlled reactive ion etching and plasma regrowth of titanium oxides of known thickness for production of metal-oxide-metal diodes
Author :
Dodd, Linzi E. ; Gallant, Andrew J. ; Wood, David
Author_Institution :
Sch. of Eng. & Comput. Sci., Durham Univ., Durham, UK
Volume :
8
Issue :
8
fYear :
2013
fDate :
Aug-13
Firstpage :
476
Lastpage :
478
Abstract :
The successful production, via two different oxidation processes, of metal-oxide-metal (MOM) diodes is presented. An innovative reactive ion etching and plasma assisted regrowth process has been used to provide oxides, which are in the thickness range 4.0-5.1 nm. These are thinner and physically more uniform than oxides grown in a furnace, resulting in diodes which should conduct via electron tunnelling across the MOM junction. Transmission electron microscopy analysis has been used in conjunction with time of flight secondary ion mass spectrometry analysis to verify oxide thickness and uniformity.
Keywords :
semiconductor diodes; sputter etching; transmission electron microscopy; tunnelling; MOM junction; controlled reactive ion etching; electron tunnelling; metal-oxide-metal diodes; oxidation process; oxide thickness; plasma assisted regrowth process; size 4 nm to 5.1 nm; time of flight secondary ion mass spectrometry analysis; titanium oxides; transmission electron microscopy analysis;
fLanguage :
English
Journal_Title :
Micro & Nano Letters, IET
Publisher :
iet
ISSN :
1750-0443
Type :
jour
DOI :
10.1049/mnl.2013.0177
Filename :
6587992
Link To Document :
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