Title :
Enhancement of Flip-Chip Light-Emitting Diodes With Omni-Directional Reflector and Textured Micropillar Arrays
Author :
Lee, Chia-En ; Lee, Yi-Jiun ; Kuo, Hao-Chung ; Tsai, Meng-Ru ; Cheng, B.S. ; Lu, Tien-Chang ; Wang, Shing-Chung ; Kuo, Chia-Tai
Author_Institution :
Nat. Chiao Tung Univ., Hsinchu
Abstract :
The flip-chip light-emitting diodes (FC-LEDs) with a conductive omni-directional reflector and textured micropillar arrays were investigated. The micropillar arrays structure was formed on the bottom side of sapphire substrate by dry etching process to increase the light-extraction efficiency. The light output power of the FC-LED was increased by 65% for a 3.2-mum textured micropillar on the bottom side of the sapphire substrate. Our work offers promising potential for enhancing output powers of commercial light-emitting devices.
Keywords :
etching; flip-chip devices; integrated optics; light emitting diodes; micro-optics; optical arrays; optical fabrication; sapphire; conductive omni-directional reflector; dry etching process; flip-chip light-emitting diodes; light-extraction efficiency; output power enhancement; sapphire substrate; size 3.2 mum; textured micropillar arrays; Light emitting diodes; Mirrors; Optical arrays; Optical reflection; Power generation; Rough surfaces; Substrates; Surface roughness; Surface texture; Thermal conductivity; Dry etching; flip-chip light-emitting diodes (FC-LEDs); micropillar-array; omni-directional reflectors (ODRs);
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2007.901718
