Title :
On the effect of defect clustering on test transparency and IC test optimization
Author :
Singh, A.D. ; Krishna, C.M.
Author_Institution :
Dept. of Electr. Eng., Auburn Univ., AL, USA
fDate :
6/1/1996 12:00:00 AM
Abstract :
We recently proposed a wafer-based testing approach which for the first time employs defect clustering information on the wafer to optimize test cost and defect levels in the shipped product. Preliminary analysis of this approach had implicitly assumed that the probability that a test detects a faulty circuit is independent of the number of faults in that circuit. This assumption may be optimistic. In this correspondence, we study the effect of clustering and test transparency on defect distributions in individual dice, and its impact on the fault detection capabilities of a given test set. We show here that significant defect-level improvements in the shipped product can indeed be achieved by exploiting defect clustering in optimization testing
Keywords :
VLSI; circuit optimisation; integrated circuit testing; integrated circuit yield; IC test optimization; defect clustering; defect levels; fault detection capabilities; faulty circuit; individual dice; optimization testing; test set; test transparency; wafer-based testing approach; Circuit faults; Circuit testing; Cost function; Electrical fault detection; Failure analysis; Fault detection; Integrated circuit testing; Integrated circuit yield; Timing; Very large scale integration;
Journal_Title :
Computers, IEEE Transactions on