• DocumentCode
    1056437
  • Title

    Conditions for the absence of thermal breakdown in silicon nitride

  • Author

    Klein, Nicholas ; Osburn, Carlton M.

  • Author_Institution
    Technion-Israel Institute of Technology, Haifa, Israel
  • Volume
    24
  • Issue
    5
  • fYear
    1977
  • fDate
    5/1/1977 12:00:00 AM
  • Firstpage
    559
  • Lastpage
    564
  • Abstract
    Conditions for thermal current runaway and breakdown are investigated for the case when the temperature dependence of the electrical conductivity decreases with increasing field. Calculations show that thermal runaway does not arise at fields higher than an upper bound, even though large currents heat the insulator. Conditions found for the absence of thermal runaway are confirmed by experimental observations on silicon nitride. Unless the thermal conductance of the sample is poor and the electrical conductivity unusually large, thermal breakdown is not expected to arise in silicon nitride films.
  • Keywords
    Conductive films; Current density; Electric breakdown; Insulation; Semiconductor films; Silicon; Temperature dependence; Thermal conductivity; Thermal resistance; Upper bound;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1977.18778
  • Filename
    1478970