DocumentCode
1056437
Title
Conditions for the absence of thermal breakdown in silicon nitride
Author
Klein, Nicholas ; Osburn, Carlton M.
Author_Institution
Technion-Israel Institute of Technology, Haifa, Israel
Volume
24
Issue
5
fYear
1977
fDate
5/1/1977 12:00:00 AM
Firstpage
559
Lastpage
564
Abstract
Conditions for thermal current runaway and breakdown are investigated for the case when the temperature dependence of the electrical conductivity decreases with increasing field. Calculations show that thermal runaway does not arise at fields higher than an upper bound, even though large currents heat the insulator. Conditions found for the absence of thermal runaway are confirmed by experimental observations on silicon nitride. Unless the thermal conductance of the sample is poor and the electrical conductivity unusually large, thermal breakdown is not expected to arise in silicon nitride films.
Keywords
Conductive films; Current density; Electric breakdown; Insulation; Semiconductor films; Silicon; Temperature dependence; Thermal conductivity; Thermal resistance; Upper bound;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1977.18778
Filename
1478970
Link To Document