DocumentCode :
1056437
Title :
Conditions for the absence of thermal breakdown in silicon nitride
Author :
Klein, Nicholas ; Osburn, Carlton M.
Author_Institution :
Technion-Israel Institute of Technology, Haifa, Israel
Volume :
24
Issue :
5
fYear :
1977
fDate :
5/1/1977 12:00:00 AM
Firstpage :
559
Lastpage :
564
Abstract :
Conditions for thermal current runaway and breakdown are investigated for the case when the temperature dependence of the electrical conductivity decreases with increasing field. Calculations show that thermal runaway does not arise at fields higher than an upper bound, even though large currents heat the insulator. Conditions found for the absence of thermal runaway are confirmed by experimental observations on silicon nitride. Unless the thermal conductance of the sample is poor and the electrical conductivity unusually large, thermal breakdown is not expected to arise in silicon nitride films.
Keywords :
Conductive films; Current density; Electric breakdown; Insulation; Semiconductor films; Silicon; Temperature dependence; Thermal conductivity; Thermal resistance; Upper bound;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1977.18778
Filename :
1478970
Link To Document :
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