DocumentCode :
1057466
Title :
Current status and future prospects of poly-Si devices
Author :
Clark, M.G.
Author_Institution :
GEC Hirst Res. Centre, Borehamwood, UK
Volume :
141
Issue :
1
fYear :
1994
fDate :
2/1/1994 12:00:00 AM
Firstpage :
3
Lastpage :
8
Abstract :
Thin-film polysilicon insulated-gate field effect transistors deposited on glass substrates are the subject of worldwide research and development activity. The greatest motivation for this is their application to flat-panel displays, including, in particular, active-matrix liquid crystal displays (AMLCDs), where they offer several important advantages over the more mature amorphous silicon thin-film transistor (TFT) technology. One of these is the ready availability of both n-type and p-type poly-Si TFTs. Polysilicon-on-glass CMOS TFT technology may be used to fabricate AMLCD drivers on the display substrate; it can also be used in a variety of other applications such as printers, scanners, smart sensors and neural networks. This review identifies the major achievements and key issues in the development of poly-Si TFT technology for both display and nondisplay applications
Keywords :
CMOS integrated circuits; elemental semiconductors; flat panel displays; insulated gate field effect transistors; liquid crystal displays; reviews; silicon; thin film transistors; IGFET; Si; TFT technology; field effect transistors; glass substrates; insulated-gate FET; n-type device; p-type device; poly-Si devices; polycrystalline Si; polysilicon; polysilicon-on-glass CMOS TFT technology; review; thin-film transistor;
fLanguage :
English
Journal_Title :
Circuits, Devices and Systems, IEE Proceedings -
Publisher :
iet
ISSN :
1350-2409
Type :
jour
DOI :
10.1049/ip-cds:19949953
Filename :
278064
Link To Document :
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