DocumentCode :
1058272
Title :
A single poly EEPROM cell structure for use in standard CMOS processes
Author :
Ohsaki, Katsuhiko ; Asamoto, Noriaki ; Takagaki, Shunichi
Author_Institution :
Adv. Syst. Dev., IBM Japan Ltd., Shigaken, Japan
Volume :
29
Issue :
3
fYear :
1994
fDate :
3/1/1994 12:00:00 AM
Firstpage :
311
Lastpage :
316
Abstract :
A single poly EEPROM cell structure implemented in a standard CMOS Process is developed. It consists of adjacently placed NMOS and PMOS transistors with an electrically isolated common polysilicon gate. The common gate works as a “floating gate”. The inversion layer as “control node (gate)”. Test chips which were fabricated in a 0.8 μm/150 Å standard CMOS logic process showed 5-9 V of threshold voltage shift and more than 10000 cycles of endurance with good data retention under high temperature. This EEPROM cell can be easily integrated with CMOS digital and analog circuits
Keywords :
CMOS integrated circuits; EPROM; integrated memory circuits; silicon; 0.8 micron; 5 to 9 V; NMOS transistors; PMOS transistors; Si; common gate; control node; data retention; endurance; floating gate; high temperature; inversion layer; polysilicon gate; single poly EEPROM cell structure; standard CMOS processes; threshold voltage shift; CMOS logic circuits; CMOS process; Circuit testing; EPROM; Logic testing; MOS devices; MOSFETs; Standards development; Temperature; Threshold voltage;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/4.278354
Filename :
278354
Link To Document :
بازگشت