DocumentCode :
1059427
Title :
Local properties at interfaces in nanodielectrics: An ab initio computational study
Author :
Shi, Ning ; Ramprasad, Ramamurthy
Volume :
15
Issue :
1
fYear :
2008
fDate :
2/1/2008 12:00:00 AM
Firstpage :
170
Lastpage :
177
Abstract :
First-principles computational methodologies are presented to study the impact of surfaces and interfaces on the dielectric and electronic properties of emerging technologically important systems over length scales of the order of inter-atomic distances. The variation of dielectric constant across Si-SiO2, Si-HfO2 and SiO2-polymer interfaces has been correlated to interfacial chemical bonding environments, using the theory of the local dielectric permittivity. The local electronic structure variation across Si-HfO2 and SiO2-polymer interfaces, including band bending, band offsets and the creation of interfacial trap states have been investigated using a layer-decomposed density of states analysis. These computational methods form the groundwork for a more thorough analysis of the impact of surfaces, interfaces, and atomic level defects on dielectric and electronic properties of a wide variety of nano-structured systems.
Keywords :
ab initio calculations; band structure; electronic density of states; filled polymers; hafnium compounds; interface states; nanocomposites; permittivity; silicon; ab initio computational study; atomic level defects; band bending; band offsets; dielectric constant; dielectric permittivity; dielectric properties; electronic properties; interfaces properties; interfacial chemical bonding; interfacial trap states; local electronic structure; nanodielectrics; surfaces impact; Chemical technology; Computer interfaces; Density functional theory; Dielectric materials; High-K gate dielectrics; Materials science and technology; Nanostructured materials; Permittivity; Polarization; Polymers;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/T-DEI.2008.4446748
Filename :
4446748
Link To Document :
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