• DocumentCode
    1059427
  • Title

    Local properties at interfaces in nanodielectrics: An ab initio computational study

  • Author

    Shi, Ning ; Ramprasad, Ramamurthy

  • Volume
    15
  • Issue
    1
  • fYear
    2008
  • fDate
    2/1/2008 12:00:00 AM
  • Firstpage
    170
  • Lastpage
    177
  • Abstract
    First-principles computational methodologies are presented to study the impact of surfaces and interfaces on the dielectric and electronic properties of emerging technologically important systems over length scales of the order of inter-atomic distances. The variation of dielectric constant across Si-SiO2, Si-HfO2 and SiO2-polymer interfaces has been correlated to interfacial chemical bonding environments, using the theory of the local dielectric permittivity. The local electronic structure variation across Si-HfO2 and SiO2-polymer interfaces, including band bending, band offsets and the creation of interfacial trap states have been investigated using a layer-decomposed density of states analysis. These computational methods form the groundwork for a more thorough analysis of the impact of surfaces, interfaces, and atomic level defects on dielectric and electronic properties of a wide variety of nano-structured systems.
  • Keywords
    ab initio calculations; band structure; electronic density of states; filled polymers; hafnium compounds; interface states; nanocomposites; permittivity; silicon; ab initio computational study; atomic level defects; band bending; band offsets; dielectric constant; dielectric permittivity; dielectric properties; electronic properties; interfaces properties; interfacial chemical bonding; interfacial trap states; local electronic structure; nanodielectrics; surfaces impact; Chemical technology; Computer interfaces; Density functional theory; Dielectric materials; High-K gate dielectrics; Materials science and technology; Nanostructured materials; Permittivity; Polarization; Polymers;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/T-DEI.2008.4446748
  • Filename
    4446748