Title :
The mechanisms leading to the useful electrical properties of polymer nanodielectrics
Author :
Smith, R.C. ; Liang, C. ; Landry, M. ; Nelson, J.K. ; Schadler, L.S.
Author_Institution :
Rensselaer Polytech. Inst, Troy
fDate :
2/1/2008 12:00:00 AM
Abstract :
Polymer nanocomposites with metal oxide nanoparticle fillers exhibit enhanced electrical breakdown strength and voltage endurance compared to their unfilled or micron filled counterparts. This paper presents the following hypothesis for the mechanisms leading to improved properties. The inclusion of nanoparticles provides myriad scattering obstacles and trap sites in the charge carriers´ paths, effectively reducing carrier mobility and thus carrier energy. The result is homocharge buildup at the electrodes, which increases the voltage required for further charge injection due to blocking by the homocharge. The hypothesis is supported by electroluminescence, pulsed electro acoustic analysis, thermally stimulated current measurements, a comparison of AC, DC, and impulse breakdown, as well as absorption current measurements, in silica/crosslinked polyethylene matrix composites with supporting evidence from titania/epoxy composites.
Keywords :
carrier mobility; electric breakdown; electroluminescence; filled polymers; nanocomposites; nanoparticles; silicon compounds; thermally stimulated currents; SiO2; absorption current; carrier energy; carrier mobility; charge carrier path; charge injection; electrical breakdown strength; electrical properties; electroluminescence; metal oxide nanoparticle fillers; myriad scattering obstacles; polymer nanocomposites; polymer nanodielectrics; pulsed electro acoustic analysis; silica/crosslinked polyethylene matrix composites; thermally stimulated current; trap sites; voltage endurance; Acoustic pulses; Acoustic scattering; Breakdown voltage; Charge carriers; Current measurement; Electric breakdown; Mechanical factors; Nanocomposites; Nanoparticles; Polymers;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/T-DEI.2008.4446750