Author :
Boning, Duane S. ; Balakrishnan, Karthik ; Cai, Hong ; Drego, Nigel ; Farahanchi, Ali ; Gettings, Karen M. ; Lim, Daihyun ; Somani, Ajay ; Taylor, Hayden ; Truque, Daniel ; Xie, Xiaolin
Author_Institution :
Massachusetts Inst. of Technol., Cambridge
Abstract :
Variation afflicts the design, manufacture, and operation of integrated circuits. Techniques and tools are needed in three areas to address variation: statistical metrology, advanced process control, and design for manufacturability. First, statistical metrology seeks to characterize and model variations and their sources. Advanced metrology helps to understand geometric and material property variations, while variation test structures and test circuits enable study of the impact of specific or aggregate variations on performance. Second, advanced process control attempts to reduce process variation through sensing and feedback/feedforward control during fabrication. Third, design for manufacturability (DFM) seeks methods to improve performance and yield given process and environmental variation, through robust design, increased regularity, and other approaches. Finally, linkages between these areas, particularly between statistical metrology and DFM, will be important and empowering.
Keywords :
integrated circuit design; integrated circuit measurement; integrated circuit testing; advanced process control; design-for-manufacturability; feedback control; feedforward control; integrated circuit design; integrated circuit fabrication; integrated circuit manufacture; integrated circuit operation; statistical metrology; test circuits; variation afflicts; variation test structure; Aggregates; Circuit testing; Design for manufacture; Integrated circuit manufacture; Manufacturing processes; Material properties; Materials testing; Metrology; Process control; Process design; Design for manufacturability (DFM); statistical process control; variation; yield;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2007.913194