Title :
Foreword Wafer Level Packaging: More of Many
Abstract :
The five papers in this special section focus on wafer level packaging.
Keywords :
Components, Packaging, and Manufacturing Technology Society; Electronics packaging; Environmentally friendly manufacturing techniques; Image sensors; Integrated circuit interconnections; Optical sensors; Radiofrequency microelectromechanical systems; Semiconductor device packaging; Thermal management; Wafer scale integration;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2008.917824
