Title :
A new horizontal thin film head
Author :
Umesaki, M. ; Ohdoi, Y. ; Hata, H. ; Yabushita, K. ; Morikawa, K. ; Kishi, H. ; Horibata, S. ; Shibata, H.
Author_Institution :
Mitsubishi Electr. Corp., Hyogo, Japan
fDate :
11/1/1991 12:00:00 AM
Abstract :
The authors have developed a novel horizontal thin film head which has a desirable core structure near the gap. The via holes of the substrate were filled with conductive paste to make electrical connections. The gap was formed on the sidewall of the half core by sputtering. The output waveform had little undershoot, and periodic ripples in the roll-off curve were reduced. With a 5-μm track width head, a signal-to-noise ratio of 25 dB at 40 kBPI was obtained
Keywords :
magnetic heads; magnetic thin film devices; 25 dB; conductive paste; horizontal thin film head; reduced roll-off curve ripples; signal-to-noise ratio; substrate; via holes; Coils; Conducting materials; Crystallization; Insulation; Laboratories; Magnetic heads; Protection; Sputtering; Substrates; Transistors;
Journal_Title :
Magnetics, IEEE Transactions on
