• DocumentCode
    1061897
  • Title

    Selective Device Structure Scaling and Parasitics Engineering: A Way to Extend the Technology Roadmap

  • Author

    Wei, Lan ; Deng, Jie ; Chang, Li-Wen ; Kim, Keunwoo ; Chuang, Ching-Te ; Wong, H. S Philip

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., Stanford, CA
  • Volume
    56
  • Issue
    2
  • fYear
    2009
  • Firstpage
    312
  • Lastpage
    320
  • Abstract
    We propose a path for extending the technology roadmap when currently considered technology boosters (e.g., strain, high-kappa/metal gate) reach their limits and physical gate length can no longer be effectively scaled down. By judiciously engineering the device parasitic resistance and parasitic capacitance, and considering the impact of the interconnect wiring capacitance, we propose scenarios of selective device structure scaling that will enable technology scaling and contacted gate pitch scaling for several generations beyond the currently perceived limits.
  • Keywords
    CMOS integrated circuits; capacitance; integrated circuit testing; CMOS; interconnect wiring capacitance; parasitic capacitance; parasitic resistance; parasitics engineering; selective device structure scaling; technology roadmap; Capacitive sensors; Circuit simulation; Circuits and systems; Contact resistance; Geometry; Integrated circuit interconnections; Materials science and technology; Parasitic capacitance; Performance gain; Plugs; Wiring; CMOS; contacted gate pitch; device geometry; device scaling; footprint; parasitic;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2008.2010573
  • Filename
    4745795