Design Optimization of Needle Geometry for Wafer-Level Probing Test

Author

Shih, Meng-Kai ; Lai, Yi-Shao

Author_Institution

Central Labs., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan

Volume

32

Issue

2

fYear

2009

fDate

6/1/2009 12:00:00 AM

Firstpage

435

Lastpage

439

Abstract

The probing test is a typical quality control method for individual chips on a wafer. With a proper design, the service life of probing needles in the probe card can be sufficiently elongated and hence reduces the testing cost. In this paper, we followed the Taguchi method with the L₁₈(2¹ times 3⁷) orthogonal array to obtain an optimal geometrical design of the probing needle based on the minimization of the scrub length the probe tip travels during a wafer-level probing test procedure. Geometrical factors of the needle included tip shape, needle diameter, beam length, taper length, knee diameter, shooting angle, tip length, and tip diameter. Importance of theses factors on the scrub length was also ranked.

Keywords

Taguchi methods; integrated circuit testing; probes; quality control; wafer level packaging; L₁₈(2¹ times 3⁷) orthogonal array; Taguchi method; beam length; knee diameter; needle diameter; needle geometry; optimal geometrical design; probing needle; quality control; scrub length minimization; shooting angle; taper length; tip diameter; tip length; tip shape; wafer-level probing test; Finite-element analysis; Taguchi method; optimization; scrub length; wafer-level probing test;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2008.2005839

Filename

4745815