DocumentCode :
1062649
Title :
H-MOS reliability
Author :
Rosenberg, Stuart J. ; Crook, Dwight L. ; Euzent, Bruce L.
Author_Institution :
Intel Corporation, Santa Clara, CA
Volume :
26
Issue :
1
fYear :
1979
fDate :
1/1/1979 12:00:00 AM
Firstpage :
48
Lastpage :
51
Abstract :
H-MOS is a new high-performance n-channel technology with a 1-pJ speed power product. This technology is the result of scaling MOS device dimensions. The effect of thinner oxide integrity and hot electron injection are investigated. A screening technique for thin oxides using high-voltage stressing is presented. Threshold shifts due to hot electron injection were observed to be less than 1 mV. Operating lifetest data predict a failure rate of 0.017 percent/1000 h on 4K static RAM´s built on H-MOS.
Keywords :
Contamination; Current density; Electric breakdown; Electron traps; Failure analysis; MOS devices; Maintenance; Secondary generated hot electron injection; Silicon; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1979.19378
Filename :
1479956
Link To Document :
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