DocumentCode
1062666
Title
New acceleration factors for temperature, humidity, bias testing
Author
Sbar, N.L. ; Kozakiewicz, R.P.
Author_Institution
Bell Laboratories, Allentown, PA
Volume
26
Issue
1
fYear
1979
fDate
1/1/1979 12:00:00 AM
Firstpage
56
Lastpage
71
Abstract
New temperature-humidity acceleration factors for surface conductance ( 
) were determined. These can be used to relate device life in a high-stress laboratory environment to device life in a normal-use environment. Analytical expressions for the acceleration factors were derived for both encapsulated and unencapsulated test specimens. Lower acceleration factors were predicted for specimens encapsulated with DC 3-6550 RTV silicone rubber than for unencapsulated specimens. The new acceleration factors were used to predict failure rates due to electrolytic conduction on active devices.
) were determined. These can be used to relate device life in a high-stress laboratory environment to device life in a normal-use environment. Analytical expressions for the acceleration factors were derived for both encapsulated and unencapsulated test specimens. Lower acceleration factors were predicted for specimens encapsulated with DC 3-6550 RTV silicone rubber than for unencapsulated specimens. The new acceleration factors were used to predict failure rates due to electrolytic conduction on active devices.Keywords
Acceleration; Circuit testing; Conductors; Humidity; Life estimation; Metallization; Silicon; Stress; Temperature; Vehicles;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1979.19380
Filename
1479958
Link To Document