• DocumentCode
    1063205
  • Title

    FE-I2: a front-end readout chip designed in a commercial 0.25-μm process for the ATLAS pixel detector at LHC

  • Author

    Blanquart, L. ; Richardson, J. ; Einsweiler, K. ; Fischer, P. ; Mandelli, E. ; Meddeler, G. ; Peric, I.

  • Author_Institution
    Lawrence Berkeley Nat. Lab., CA, USA
  • Volume
    51
  • Issue
    4
  • fYear
    2004
  • Firstpage
    1358
  • Lastpage
    1364
  • Abstract
    A new front-end chip (FE-I2) has been developed for the ATLAS pixel detector at the future Large Hadron Collider (LHC) accelerator facility of the European Laboratory for Particle Physics (CERN). This chip has been submitted in a commercial 0.25-μm CMOS process using special layout techniques for radiation tolerance. It comprises 2880 pixels arranged into 18 columns of 160 channels. Each pixel element of dimension 50 μm × 400 μm is composed of a charge- sensitive amplifier followed by a fast discriminator with a detection threshold adjustable within a range of 0-6000 electrons and slow control logic incorporating a wired-hit-Or, preamplifier-kill, readout mask, and automatic threshold tuning circuitry. There are two single-event-upset (SEU)-tolerant DACs for reducing threshold (7-b) and recovery-time (3-b) mismatches from pixel to pixel along with digital hit emulation and a differential readout circuit aimed at transporting time-stamped data from each pixel to buffers at the bottom of the chip. In comparison to previous generations of the ATLAS pixel chip, FE-I2 incorporates many new features such as embedded "smart" decoupling capacitances, long-term overvoltage protection, linear regulators, a capacitance calibration charge-pump circuit, a power-on reset, and a leakage current monitoring circuit. Its predecessor (FE-I1) has been demonstrated to operate correctly after ionizing radiation doses exceeding 50 Mrad (SiO2). Special techniques employed for digital pick-up reduction are also described.
  • Keywords
    high energy physics instrumentation computing; leakage currents; nuclear electronics; position sensitive particle detectors; readout electronics; silicon radiation detectors; ATLAS pixel detector; CERN; CMOS process; FE-I1; FE-I2 front-end readout chip; LHC; Large Hadron Collider accelerator facility; active bias distribution; automatic threshold tuning circuitry; buffers; capacitance calibration charge-pump circuit; charge-sensitive amplifier; detection threshold; differential readout circuit; digital hit emulation; digital pick-up reduction; embedded smart decoupling capacitances; fast discriminator; hybrid pixel sensor; ionizing radiation dose; leakage current compensation; leakage current monitoring circuit; linear regulator; long term overvoltage protection; multichip module; pixel element dimension; power-on reset; preamplifier-kill; radiation tolerance; readout mask; recovery-time; shielding technique; single-event-upset-tolerant DAC; slow control logic; threshold adjustment; time-over-threshold; time-stamped data; wired-hit-Or; Automatic control; Automatic logic units; CMOS process; Capacitance; Circuits; Detectors; Electrons; Laboratories; Large Hadron Collider; Particle accelerators;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2004.832895
  • Filename
    1323697