DocumentCode :
1063290
Title :
A fully implanted NMOS, CMOS, bipolar technology for VLSI of analog-digital systems
Author :
Zimmer, Günter ; Hoefflinger, Bernd ; Schneider, Joachim
Author_Institution :
University of Dortmund, Dortmund, Germany
Volume :
26
Issue :
4
fYear :
1979
fDate :
4/1/1979 12:00:00 AM
Firstpage :
390
Lastpage :
396
Abstract :
A fully ion-implanted process allows high-density integration of NMOS, CMOS, and bipolar transistors for VLSI of analog-digital systems. Supply voltage can be 20 V. Thresholds are ± 1.5 V for p- and n-channel enhancement transistors, respectively. Standard deviation per wafer is 15 mV for the NMOS threshold, while the NMOS gain constant is 30 µAV-2. The bipolar transistors have a low-resistance base contact. Current gain βFcan be set independently. For \\beta _{F} = 90 , the Early voltage is V_{A} = 110 V. No epi layer, isolation diffusions, or channel stoppers are required. The mask count is 6 for structure definition plus 2 for the masking of implants. The process can be scaled along the learning curve of digital MOS VLSI.
Keywords :
Analog-digital conversion; Bipolar transistors; CMOS process; CMOS technology; Circuits; Implants; Large scale integration; MOS devices; Very large scale integration; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1979.19440
Filename :
1480018
Link To Document :
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