A fully ion-implanted process allows high-density integration of NMOS, CMOS, and bipolar transistors for VLSI of analog-digital systems. Supply voltage can be 20 V. Thresholds are ± 1.5 V for p- and n-channel enhancement transistors, respectively. Standard deviation per wafer is 15 mV for the NMOS threshold, while the NMOS gain constant is 30 µAV
-2. The bipolar transistors have a low-resistance base contact. Current gain β
Fcan be set independently. For

, the Early voltage is

V. No epi layer, isolation diffusions, or channel stoppers are required. The mask count is 6 for structure definition plus 2 for the masking of implants. The process can be scaled along the learning curve of digital MOS VLSI.